Inductor devices – Coils of special configuration – Planar type
Patent
1994-06-13
1996-10-15
Thomas, Laura
Inductor devices
Coils of special configuration
Planar type
336200, 336 83, 174250, 174260, H01F 2728
Patent
active
055658377
ABSTRACT:
In a low-profile printed circuit device, a first substrate is provided with a planar magnetic transformer and a planar magnetic inductor. The transformer and the inductor each have a primary winding defining spiral conductive patterns disposed on opposite sides of the first substrate relative to each other, and an inductive core extending through a respective inner aperture formed through the first substrate and surrounded by the respective primary winding. A second substrate is also provided, having a secondary transformer winding and a secondary inductor winding. Each secondary winding defines respective spiral conductive patterns disposed on opposite sides of the second substrate, and surrounding respective inner apertures extending through the second substrate. The second substrate is surface mounted onto the first substrate, with the secondary transformer winding overlying the primary transformer winding, and the secondary inductor winding overlying the primary inductor winding, so that each secondary winding generates an additional electrical output. Dielectric coatings cover both sides of each of the first and second substrates, and each defines margin portions covering the surfaces defining each inner aperture. Each margin portion projects into the aperture toward the respective inductive core for insulating the windings relative to each other and relative to the cores.
REFERENCES:
patent: 3129398 (1964-04-01), Lheureux
patent: 3161850 (1964-12-01), Klug
patent: 3436687 (1969-04-01), Andrews, Jr. et al.
patent: 3484697 (1969-12-01), Abend
patent: 3504276 (1970-03-01), Proctor et al.
patent: 3539309 (1970-11-01), Helgeland
patent: 3549825 (1970-12-01), Trimble
patent: 3685144 (1972-08-01), Trimble
patent: 3736543 (1973-05-01), Lademann et al.
patent: 4012703 (1977-03-01), Chamberlayne
patent: 4223290 (1980-09-01), Agatahama et al.
patent: 4494100 (1985-01-01), Stengel et al.
patent: 4543553 (1985-09-01), Mandai et al.
patent: 4547961 (1985-10-01), Bokil et al.
patent: 4622627 (1986-11-01), Rodriguez et al.
patent: 4651254 (1987-03-01), Brede et al.
patent: 5010314 (1991-04-01), Estrov
patent: 5032815 (1991-07-01), Kobayashi et al.
patent: 5039964 (1991-08-01), Ikeda
patent: 5067230 (1991-11-01), Meunier et al.
patent: 5319342 (1991-06-01), Kuroki
patent: 5353001 (1994-10-01), Meinel
IBM Technical Disclosure Bulletin, vol. 19, No. 10, Mar. 1977, "Double Flat Coil For Bubble Memory Package", pp. 3713-3714.
Godek Paul W.
Grennan Michael J.
Nidec America Corporation
Thomas Laura
LandOfFree
Low profile printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low profile printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile printed circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1249704