Low profile modular receptacle and method of making same

Electrical connectors – With coupling movement-actuating means or retaining means in... – Having push-pull contacts spaced along only one planar side...

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Details

29883, 439358, 439722, 439736, H01R 13405

Patent

active

047862599

ABSTRACT:
A low profile modular telephone receptacle (15) is shown. A unitary housing (16) having a pair of transverse support members (35, 36) is provided. A top plate (17) having the necessary plurality of conductors (20) embedded therein is also provided. During assembly, the ends (22, 25) of the conductor are bent to predetermined angles (62, 65) and the top plate is joined to the bottom plate by ultrasonic welding. The resultant receptacle is one in which a minimum height dimension (h) above the necessary height dimension of the opening (18) to accept a standard modular plug is provided. In the preferred method of construction, the top plates (17) are injection molded onto continuous strands of filaments to form the conductors (20). A plurality of slots (55, 56) are provided at one end of the top plate to guide the conductors corresponding openings (46) in the bottom plate when the ends of the conductors forming a terminal set for connecting the receptacle to a utilization circuit are fabricated.

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