Low profile integrated circuit connector and method

Details Low profile integrated circuit connector and method Low profile integrated circuit connector and method

1974-04-15

1976-08-17

Lake, Roy

Geometrical instruments

29626, 339 17CF, 339176MP, 339176SF, H01R 916, H05K 110

Patent

active

039750728

ABSTRACT:
A low profile connector for electrical components having a plurality of leads extending therefrom, such as integrated circuit packages. Rectangular folded contacts, each having an open top lead receiving socket portion, are press fitted into aligned apertures in a substrate with the socket portions lying above the substrate surface. An insulative housing having recesses therein open at each end is laid over the ends of the contacts to receive each one of the socket portions up into a recess in the housing. A component is receiving onto the top surface of the housing with the leads therefrom extending down through the top openings of the recesses into the lead receiving socket portions of the contacts.

REFERENCES:
patent: 3660726 (1972-05-01), Ammon
patent: 3717841 (1973-02-01), Mancini
patent: 3718895 (1973-02-01), Reynolds et al.
patent: 3732529 (1973-05-01), Weisenburger
patent: 3754203 (1973-08-01), Pauza et al.
patent: 3796988 (1974-03-01), Palombella
patent: 3853389 (1974-12-01), Occhipinti

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