Low profile inductors for high density circuit boards

Details Low profile inductors for high density circuit boards Low profile inductors for high density circuit boards

2009-07-22

2011-10-18

Mai, Anh (Department: 2832)

Inductor devices

Winding with terminals, taps, or coil conductor end...

C336S083000, C336S200000, C336S221000, C336S222000

Reexamination Certificate

active

08040212

ABSTRACT:
An inductor includes a core formed of a magnetic material and a foil winding wound at least partially around or through at least a portion of the core. A first end of the winding extends away from the core to form an extended output tongue configured and arranged to supplement or serve as a substitute for a printed circuit board foil trace. A second end of the winding forms a solder tab. At least a portion of the extended output tongue and the solder tab are formed at a same height relative to a bottom surface of the core. Another inductor includes a core formed of a magnetic material, a winding wound at least partially around or through at least a portion of the core, and a ground return conductor attached to the core. The core does not form a magnetic path loop around the ground return conductor.

REFERENCES:
patent: 3185947 (1965-05-01), Freymodsson
patent: 3988665 (1976-10-01), Neumaier et al.
patent: 4455545 (1984-06-01), Shelly
patent: 4777406 (1988-10-01), Ross et al.
patent: 4800479 (1989-01-01), Bupp
patent: 4935790 (1990-06-01), Cappelletti et al.
patent: 5023578 (1991-06-01), Kaneko et al.
patent: 5161098 (1992-11-01), Balakrishnan
patent: 5225971 (1993-07-01), Spreen
patent: 5353001 (1994-10-01), Meinel et al.
patent: 5436818 (1995-07-01), Barthold
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5565837 (1996-10-01), Godek et al.
patent: 5568111 (1996-10-01), Metsler
patent: 5574420 (1996-11-01), Roy et al.
patent: 5631822 (1997-05-01), Siberkleit et al.
patent: 5939966 (1999-08-01), Shin' Ei
patent: 6060977 (2000-05-01), Yamamoto et al.
patent: 6114932 (2000-09-01), Wester et al.
patent: 6198375 (2001-03-01), Shafer
patent: 6204744 (2001-03-01), Shafer et al.
patent: 6342778 (2002-01-01), Catalano et al.
patent: 6348848 (2002-02-01), Herbert
patent: 6356179 (2002-03-01), Yamada
patent: 6362986 (2002-03-01), Schultz et al.
patent: 6377155 (2002-04-01), Allen et al.
patent: 6420953 (2002-07-01), Dadafshar
patent: 6449829 (2002-09-01), Shafer
patent: 6460244 (2002-10-01), Shafer et al.
patent: 6477414 (2002-11-01), Silvian
patent: 6549111 (2003-04-01), De Graaf et al.
patent: 6578253 (2003-06-01), Herbert
patent: 6867678 (2005-03-01), Yang
patent: 6903648 (2005-06-01), Baumann et al.
patent: 7034645 (2006-04-01), Shafer et al.
patent: 7187263 (2007-03-01), Vinciarelli
patent: 7199695 (2007-04-01), Zhou et al.
patent: 7248139 (2007-07-01), Podlisk et al.
patent: 7280025 (2007-10-01), Sano
patent: 7310039 (2007-12-01), Zhang
patent: 7352269 (2008-04-01), Li et al.
patent: 7492246 (2009-02-01), Chang
patent: 7498920 (2009-03-01), Sullivan et al.
patent: 7525406 (2009-04-01), Cheng
patent: 2002/0067234 (2002-06-01), Kung
patent: 2002/0093413 (2002-07-01), Shin'ei
patent: 2004/0017276 (2004-01-01), Chen et al.
patent: 2005/0128040 (2005-06-01), Gray et al.
patent: 2006/0049907 (2006-03-01), Liu
patent: 2006/0158297 (2006-07-01), Sutardja
patent: 2007/0175701 (2007-08-01), Xu et al.
patent: 2007/0176726 (2007-08-01), Xu et al.
patent: 2007/0268104 (2007-11-01), Chan et al.
patent: 2008/0136576 (2008-06-01), Emmons et al.
patent: 2008/0150666 (2008-06-01), Chandrasekaran et al.
patent: 2008/0205098 (2008-08-01), Xu et al.
patent: 2008/0272874 (2008-11-01), Chang
patent: 2009/0179723 (2009-07-01), Ikriannikov et al.
patent: 2009/0231081 (2009-09-01), Ikriannikov et al.
patent: 1 632 964 (2006-03-01), None
patent: 1 833 165 (2007-09-01), None
patent: 2002057049 (2002-02-01), None
patent: WO 2006/026674 (2006-03-01), None
PCT/US10/42938 International Search Report & Written Opinion mailed Dec. 2, 2010, 18 pages.
Wong, Pit-Leong, et al., “Investigating Coupling Inductors in the Interleaving QSW VRM” Applied Power Electronics Conference and Exposition, 2000. APEC 2000. Fifteenth Annual IEEE; Mar. 2000; pp. 973-978.
Wong, Pit-Leong, et al.; A Novel Modeling Concept for Multi-coupling Core Structures; Center for Power Electronics Systems; IEEE; pp. 107; 2001.
Wong, Pit-Leong, et al.; Performance Improvements of Interleaving VRMs With Coupling Inductors, IEEE Transactions on Power Electronics; vol. 16, No. 4; pp. 499-507; Jul. 2001.
Xu, J., et al; Analysis by Finite Element Method of a Coupled Inductor Circuit Used as Current Injection Interface; IEEE Workshop on Computers in Power Electronics; pp. 147-151; 1996.
Cooper Bussmann, “Product Data Sheet for Low Profile Inductor (Surface Mount)” retreived from http://www.angliac.com, May 2003.
Pulse, SMT Power Inductors Power Beads—PA0766NL Series; pp. 53-55; Mar. 2006.
Vitec, Dual High Frequency High Power Inductor, AF4390A data sheet; date unknown.
Dong et al., Twisted Core Coupled Inductors for Microprocessor Voltage Regulators, Power Electronics Specialists Conference, pp. 2386-2392, Jun. 17-21, 2007.
Dong et al., The Short Winding Path Coupled Inductor Voltage Regulators, Applied Power Electronics Conference and Exposition, pp. 1446-1452, Feb. 24-28, 2008.
Dong et al., Evaluation of Coupled Inductor Voltage Regulators, Applied Power Electronics Conference and Exposition, pp. 831-837, Feb. 24-28, 2008.
Pulse, SMT Power Inductors datasheet, 2 pages, Nov. 2007.
U.S. Appl. No. 12/643,957, Response to Office Action filed May 23, 2011, 19 pages.
U.S. Appl. No. 12/643,957, Non-Final Rejection mailed Feb. 23, 2011, 7 pages.
PCT/US10/60869, International Search Report and Written Opinion mailed May 13, 2011, 14 pages.

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