Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-04-25
1999-05-25
Tolin, Gerald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174 524, H05K 720
Patent
active
059074744
ABSTRACT:
A low-profile heat transfer apparatus is presented for a surface-mounted semiconductor device employing a ball grid array (BGA) device package having a chip mounted upon a substantially flat upper surface of a substrate. The semiconductor device is mounted upon a component side of a printed circuit board (PCB), and the heat transfer apparatus is used to transfer heat energy from the semiconductor device to an ambient. A thermally conductive cap structure is positioned between the semiconductor device and the ambient. The cap structure includes a bottom surface having a first cavity sized to receive the substrate and possibly any decoupling capacitors. During use, the substrate resides within the first cavity. In a first embodiment, the chip resides within a second cavity in an upper wall of the first cavity during use. The chip and substrate are thermally coupled to the cap structure by a first and second thermal interface layer, respectively. The use of two thermal interface layers achieves a relatively low value of .theta..sub.JS, allowing the cap structure to remain relatively small. In a second embodiment, the chip resides within a hole in the cap structure during use such that the upper surface of the chip is exposed to the ambient. The substrate is thermally coupled to the cap structure by a thermal interface layer. The achieved value of .theta..sub.JS is acceptably low for some applications, and the height of the cap structure relative to the component side of the PCB is substantially reduced.
REFERENCES:
patent: 5367193 (1994-11-01), Malladl
patent: 5396403 (1995-03-01), Patel
patent: 5585671 (1996-12-01), Nagesh
patent: 5710459 (1998-01-01), Teng
IBM Tech Discl Bull vol. 22 No. 6 Nov. 1979 p. 2294 Structure . . . Module (Arnold).
Advanced Micro Devices , Inc.
Daffer Kevin L.
Tolin Gerald
LandOfFree
Low-profile heat transfer apparatus for a surface-mounted semico does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low-profile heat transfer apparatus for a surface-mounted semico, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low-profile heat transfer apparatus for a surface-mounted semico will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-404961