Low profile header assembly for an encapsulated instrument

Details Low profile header assembly for an encapsulated instrument Low profile header assembly for an encapsulated instrument

1993-06-16

1994-05-10

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361730, 361761, 361807, 360 84, 360109, 439 44, 174261, H05K 114

Patent

active

053114000

ABSTRACT:
A low profile header assembly for an encapsulated instrument includes a plate member with a cavity which is on the side of the plate member external to the instrument. Terminal pins extend through the plate member both within the cavity and beyond its periphery. Hybrid amplifier circuitry is disposed within the cavity and electrically connected to the pins within the cavity. The cavity is hermetically sealed and the internal components of the instrument are electrically connected to the terminal pins within the instrument shell.

REFERENCES:
patent: 4095206 (1978-06-01), Hishiki
patent: 4621529 (1986-11-01), Pittman
patent: 4835645 (1989-05-01), Ohji et al.
patent: 5010432 (1991-04-01), Fukushima et al.

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