Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-07-20
2002-07-23
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S753000, C361S807000
Reexamination Certificate
active
06424539
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a gigabyte interface converter (GBIC), and in particular to an assembly of a GBIC and a printed circuit board (PCB) forming a low profile configuration.
2. Description of Related Art
An optoelectronic transceiver module provides for bi-directional transmission of data between an optical data media and an electrical interface. Generally, a transceiver module comprises an outer guide rail by which the transceiver module is contained and fixed up.
A stacked GBIC guide rail assembly comprises a lower guide frame and at least one upper guide frame for each supporting one transceiver module therein. The lower guide frame is attached to a surface of the printed circuit board (PCB) with pins extending through and soldered on the PCB. Alternatively, a GBIC guide rail can be fixed to the surface of the PCB by an electrical connector (See U.S. Pat. No. Re 36,820). Disadvantages are associated with such a connection between a guide frame and a PCB. For example, the connection between the lower guide frame and PCB may cause short-circuit of the PCB. Furthermore, the conventional stacked GBIC guide rail takes a large amount of space above the PCB.
It is thus desirable to provide a lower profile stacked GBIC guide rail for overcoming the above problems.
SUMMARY OF THE INVENTION
In accordance with the present invention, an assembly of a GBIC guide rail and a PCB is provided. The GBIC guide rail is partially received in a cutout defined in the PCB and forms sideways-extending support posts for supporting the GBIC guide rail on the PCB, forming a low profile configuration of the GBIC guide rail.
REFERENCES:
patent: 4397513 (1983-08-01), Clark et al.
patent: 4939623 (1990-07-01), Equi et al.
patent: 6094352 (2000-07-01), Reddy et al.
patent: 6215666 (2001-04-01), Hileman et al.
patent: 6241534 (2001-06-01), Neer et al.
patent: 6264499 (2001-07-01), Costello et al.
Chung Wei Te
Cuneo Kamand
Dinh Tuan
Hon Hai - Precision Ind. Co., Ltd.
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