Low profile electronic circuit modules

Details Low profile electronic circuit modules Low profile electronic circuit modules

1996-05-02

1999-08-10

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174259, 174260, 174261, 361767, 361770, H05K 111

Patent

active

059368470

ABSTRACT:
An improved circuit module construction for mounting and interconnecting electronic components to substrates, which is applicable to mounting a wide variety of electronic components and conductors, including inverted or `flip chip` mounted integrated circuits. The components are mounted to the substrate with a sandwiched non-conductive polymer layer which acts as the bonding agent and underfill. The substrate and underfill have apertures aligned with signal traces on the substrate and the contacts of the component and conductive polymer is injected through the apertures to fill the area between the substrate contacts and the component contacts, to secure good electrical connection. In one embodiment the non-conductive polymer is printed on the contact side of the substrate with gaps for the contacts. In another embodiment B-staged non-conductive polymer is coated on the non-contact side of the substrate, prior to forming contact apertures and mounting of components. Conductive polymer is then injected in the apertures to make the electrical connections, and the assembly is cured. No coating or pre-treatment of the components is needed.

REFERENCES:
patent: 5189505 (1993-02-01), Bartelink
patent: 5196371 (1993-03-01), Kulesza et al.
patent: 5237130 (1993-08-01), Kulesza et al.
patent: 5406459 (1995-04-01), Tsukamoto et al.
patent: 5407864 (1995-04-01), Kim
patent: 5534442 (1996-07-01), Parker te al.

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