Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent
1992-05-06
1993-06-01
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
Sheet, web, wire, or filament
204208, C25D 104, C25D 1700
Patent
active
052156460
ABSTRACT:
A one-step electrolytic process and apparatus for producing metal foil, e.g., copper foil having a low profile treated surface for use in fabricating printed circuit boards, wherein primary foil is electrodeposited on a cathode in a first electrodeposition zone using a first current density while circulating electrolyte therein under turbulent flow conditions, and micronodules of the metal are electrodeposited on a matte surface of the primary foil in a second electrodeposition zone using a second current density greater than the first current density while circulating electrolyte therein under laminar flow conditions. A grain refining agent is employed in the electrolyte to further improve the quality. The process provides a low profile finished foil having a high peel strength.
REFERENCES:
patent: 3625844 (1971-12-01), McKean
patent: 3674656 (1972-07-01), Yates
patent: 3853716 (1974-12-01), Yates et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 4572768 (1986-02-01), Wolski et al.
Acx Kurt
Maquet Laure M.
Mathieu Michel
Wolski Adam M.
Circuit Foil USA, Inc.
Tufariello T. M.
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