Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-04-08
1996-10-22
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
055671667
ABSTRACT:
A low profile connector is provided by the invention. According to the invention two sets of contacts are secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. A first end of each contact can be coupled to an I/O lead of a printed circuit board and a second end of each contact remains unsupported. A mating low profile connector according to the invention similarly provides two sets of contacts secured in a housing capable of being mounted to a printed circuit board so that the contacts extend laterally from the housing in parallel to the printed circuit board. The contacts are compliant and are designed to extend above the mating reference of the connector. The dimensions of the contacts are selected to provide minimum pitch and optimal compliance. A process for making the low profile connector by molding a contract strip into a housing is also disclosed. Additionally, a process for using the connectors to connect printed circuit boards in a stacked arrangement is disclosed.
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Timothy A. Lemke, Richard A. Elco, Du Pont Electronics; "Designing for Packaging in the 90's--High Performance, Density and Pin Count"; Connection Technology, Aug. 1990.
Abrams Neil
Berg Technology Inc.
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