Low profile connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

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439857, 439 83, H01R 1200

Patent

active

060423897

ABSTRACT:
A low profile board to board connector system is disclosed. Retention areas in the respective mating connectors are utilized to receive portions of opposed mating contact terminals. Utilization of centralized retention structures allows optimum placement of areas to receive distal portions of mating contact terminals. These centralized retention structures also allow maximization of contact beam length in limited available space, so that favorable contact characteristics are achieved. Contact insertion/retention features are positioned at intermediate locations of the contact beams, for enhanced contact retention and improved beam performance. Terminal contacts may be retained in a passage by projections that engage openings formed in the retention portion of the contact terminal.

REFERENCES:
patent: 2231347 (1941-02-01), Reutter
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3719981 (1973-03-01), Steltz
patent: 3864004 (1975-02-01), Friend
patent: 3865462 (1975-02-01), Cobaugh et al.
patent: 3889364 (1975-06-01), Krueger
patent: 4056302 (1977-11-01), Braun et al.
patent: 4097266 (1978-06-01), Takahaski et al.
patent: 4140361 (1979-02-01), Sochor
patent: 4380518 (1983-04-01), Wydro
patent: 4395086 (1983-07-01), Marsh
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4482937 (1984-11-01), Berg
patent: 4641426 (1987-02-01), Hartman et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4678250 (1987-07-01), Romine et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4722470 (1988-02-01), Johary
patent: 4767344 (1988-08-01), Noschese
patent: 4830264 (1989-05-01), Bitalilloou
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 4884335 (1989-12-01), McCoy et al.
patent: 4904212 (1990-02-01), Durbin et al.
patent: 5024372 (1991-06-01), Altman et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5093986 (1992-03-01), Mandal et al.
patent: 5098311 (1992-03-01), Roaath et al.
patent: 5111991 (1992-05-01), Clawson et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5120237 (1992-06-01), Fusslee
patent: 5131871 (1992-07-01), Banakis et al.
patent: 5145104 (1992-09-01), Apap et al.
patent: 5199885 (1993-04-01), Korsunsky et al.
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5207372 (1993-05-01), Funari et al.
patent: 5222649 (1993-06-01), Funari et al.
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5255839 (1993-10-01), Alves et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5269453 (1993-12-01), Melton et al.
patent: 5275330 (1994-01-01), Isaacs et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5346118 (1994-09-01), Degani et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5358417 (1994-10-01), Schmedding
patent: 5377902 (1995-01-01), Hayes
patent: 5387139 (1995-02-01), McKee et al.
patent: 5409157 (1995-04-01), Nagesh et al.
patent: 5410807 (1995-05-01), Brose et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5435482 (1995-07-01), Variot et al.
patent: 5442852 (1995-08-01), Danner
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5462456 (1995-10-01), Howell
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5477933 (1995-12-01), Nguyen
patent: 5489750 (1996-02-01), Sakemi et al.
patent: 5491303 (1996-02-01), Weiss
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5495668 (1996-03-01), Furusawa et al.
patent: 5498167 (1996-03-01), Seto et al.
patent: 5499487 (1996-03-01), McGill
patent: 5504277 (1996-04-01), Danner
patent: 5516030 (1996-05-01), Denton
patent: 5516032 (1996-05-01), Sakemi et al.
patent: 5518410 (1996-05-01), Masami
patent: 5519580 (1996-05-01), Natarajan et al.
patent: 5534127 (1996-07-01), Sakai
patent: 5539153 (1996-07-01), Schwiebert et al.
patent: 5542174 (1996-08-01), Chiu
patent: 5593322 (1997-01-01), Swamy et al.
Research Disclosure, Aug. 1990, No. 316, Kenneth Mason Publications Ltd., England.
Research Disclosure, Oct. 1992, No. 342, Kenneth Mason Publications Ltd., England.
IBM Technical Disclosure Bulletin, vol. 20, No. 2, (Jul. 1977).
IBM Technical Disclosure Bulletin, vol. 32, No. 11 (Apr. 1990).
IBM Technical Disclosure Bulletin, vol. 14, No. 8 (Jan. 1972).
Berg Electronics Catalog, Page 13-96, Solder Washers.
Philip C. Kazmierowicz, "The Science Behind Conveyor Oven Thermal Profiling" KIC Oven.
Profiling, from Feb. 1990 issue of Surface Mount Technology.
Alphametals, Micro Electronic Interconnects.

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