Low profile clamping mechanism for connecting a printed circuit

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H01R 907

Patent

active

059717726

ABSTRACT:
A clamping mechanism (10) for connecting a printed circuit board (12) having a plurality of electrically conductive pads (14) to a flexible printed circuit having a plurality of electrically conductive raised dots (18). A housing (20) having a mouth (22) is located upon the printed circuit board at the plurality of pads. A pair of L-shaped leaf springs (28, 28') are connected with the housing. A cam body (40) having a rounded cam surface (42), an opposite grasping lever (44), and a pair of opposing first and second flat surfaces (46, 48) therebetween is rotatably connected to the leaf springs. A first stiffener (58) is attached to the flexible printed circuit opposite the raised dots thereof which is configured to alignably fit with the shape of the mouth of the housing to thereby align the raised dots with the pads. A second stiffener (54) is provided at the printed circuit board opposite the housing.

REFERENCES:
patent: 4420206 (1983-12-01), Martyniak
IBM Technical Disclosure Bulletin, vol. 28, No. 11, pp. 4989, Apr. 1986.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low profile clamping mechanism for connecting a printed circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low profile clamping mechanism for connecting a printed circuit , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile clamping mechanism for connecting a printed circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-757071

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.