Low-profile capillary for wire bonding

Details Low-profile capillary for wire bonding Low-profile capillary for wire bonding

2008-01-22

2008-01-22

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S001100, C228S110100, C228S180500

Reexamination Certificate

active

07320425

ABSTRACT:
A wire bonding tool includes a first cylindrical portion having a first outside diameter and a second cylindrical portion adjacent the first cylindrical portion. The second cylindrical portion has a second outside diameter, the second outside diameter being less than the first outside diameter. The wire bonding tool also includes a tapered portion adjacent the second cylindrical portion. The tapered portion has a third outside diameter at an end adjacent the second cylindrical portion, the third outside diameter being less than the first outside diameter.

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