Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-04-26
2011-04-26
Prasad, Chandrika (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07931477
ABSTRACT:
An electrical connector comprises a generally rectangular dielectric housing with a mating face and a mounting face. A plurality of terminal support posts extend in a direction from the mounting face towards the mating face and each support post has oppositely facing first and second sidewalls and a connecting surface. A plurality of terminal receiving cavities are spaced along a longitudinal axis of the housing for receiving terminals therein. A plurality of terminals are provided with each including a solder tail portion and a generally U-shaped contact portion. The solder tail portion is positioned along the mounting face and the contact portion includes a first, distal contact leg, a second, proximal contact leg spaced from and generally parallel to the first contact leg and a connecting portion extending between the first and second contact legs. The first contact leg extends along the first sidewall, the second contact leg extending along the second sidewall, and the connecting portion extending along the connecting surface.
REFERENCES:
patent: 5476389 (1995-12-01), Ono
patent: 5876217 (1999-03-01), Ito et al.
patent: 6793506 (2004-09-01), Hirata et al.
patent: 6811411 (2004-11-01), Hirata et al.
patent: 6986670 (2006-01-01), Okura et al.
patent: 7413444 (2008-08-01), Wang
patent: 7568919 (2009-08-01), Hoshino et al.
patent: 2007/0275575 (2007-11-01), Wang
patent: 2000-157197 (2001-12-01), None
patent: 200410039258.9 (2004-09-01), None
patent: WO 2005/034296 (2005-04-01), None
International Search Report for PCT/US2004/028443.
Asakawa Tetsuya
Hirata Toshihisa
Molex Incorporated
Morella Timothy M.
Prasad Chandrika
LandOfFree
Low profile board-to-board connector mating pair with solder... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low profile board-to-board connector mating pair with solder..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low profile board-to-board connector mating pair with solder... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2739369