Low-profile ball-grid array semiconductor package and method

Details Low-profile ball-grid array semiconductor package and method Low-profile ball-grid array semiconductor package and method

1995-11-03

1997-06-17

Picardat, Kevin

Fishing, trapping, and vermin destroying

437211, 437214, 437217, 437219, H01L 2160

Patent

active

056396953

ABSTRACT:
A ball-grid array (BGA) semiconductor package (10,60,90) includes a substrate (31,61,91) attached to a support substrate (32,62,92). The substrate (31,61,91) has an opening (33) extending from an upper surface to a lower surface. An integrated circuit chip (18) is attached to the support substrate (32,62,92) within the opening (33). Bond pads (22) on the integrated circuit chip (18) are electrically connected to ball pads (42,73,106,108) on the lower surface of the substrate (31,61,91). Conductive solder balls (26) are attached to the ball pads (42,73,106,108). The support substrate (32,62,92) provides a low profile and functions as a standoff that limits the collapse of the conductive solder balls (26) when the BGA semiconductor package (10,60,90) is attached to an application board (46).

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