Low profile backshell/wiring integration and interface system

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement

Patent

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Details

439607, 439610, H01R 909

Patent

active

053422031

ABSTRACT:
Multiple conductor wire harnesses in aircraft or the like are interconnected by a single low profile compact backshell assembly. The backshell assembly includes a housing which shields the individual conductors in the housing from ambient EMI noise. The housing has one or more wire harness inlet assemblies and a plurality of outlet sockets. One or more semi-flexible circuit boards are disposed in the housing and are operable to interconnect the individual conductor wires in each inlet with pin and socket conductor connections at the respective outlets. The circuit board provides interconductor EMI noise shielding inside of the housing. Splice connections between conductors can be formed as necessary within the circuit board inside of the housing to allow any degree of inlet to outlet conductor signal paths to be formed inside of the housing as are desired.

REFERENCES:
patent: 3701964 (1972-10-01), Cronin
patent: 4950171 (1990-08-01), Muzslay
patent: 5007843 (1991-04-01), Smolley
patent: 5170008 (1992-12-01), Evans et al.
patent: 5227955 (1993-07-01), Le Bris et al.
patent: 5244417 (1993-09-01), Perretta et al.
patent: 5246376 (1993-09-01), Schuhl et al.

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