Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Within distinct housing spaced from panel circuit arrangement
Patent
1993-05-25
1994-08-30
Nguyen, Khiem
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Within distinct housing spaced from panel circuit arrangement
439607, 439610, H01R 909
Patent
active
053422031
ABSTRACT:
Multiple conductor wire harnesses in aircraft or the like are interconnected by a single low profile compact backshell assembly. The backshell assembly includes a housing which shields the individual conductors in the housing from ambient EMI noise. The housing has one or more wire harness inlet assemblies and a plurality of outlet sockets. One or more semi-flexible circuit boards are disposed in the housing and are operable to interconnect the individual conductor wires in each inlet with pin and socket conductor connections at the respective outlets. The circuit board provides interconductor EMI noise shielding inside of the housing. Splice connections between conductors can be formed as necessary within the circuit board inside of the housing to allow any degree of inlet to outlet conductor signal paths to be formed inside of the housing as are desired.
REFERENCES:
patent: 3701964 (1972-10-01), Cronin
patent: 4950171 (1990-08-01), Muzslay
patent: 5007843 (1991-04-01), Smolley
patent: 5170008 (1992-12-01), Evans et al.
patent: 5227955 (1993-07-01), Le Bris et al.
patent: 5244417 (1993-09-01), Perretta et al.
patent: 5246376 (1993-09-01), Schuhl et al.
Perretta Frederick A.
Yednasty Joseph S.
Jones William W.
Nguyen Khiem
United Technologies Corporation
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