Low-pressure, no-cool phenolic type resin for decorative laminat

Details Low-pressure, no-cool phenolic type resin for decorative laminat Low-pressure, no-cool phenolic type resin for decorative laminat

1976-05-24

1978-01-17

Bleutge, John C.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

C-metal

260 676R, 156335, 428535, C08L 6126, C08G 1212

Patent

active

040692760

ABSTRACT:
Phenolic resins employed in the manufacture of high-pressure decorative laminates are modified by the addition of a partially etherified melamine-formaldehyde resin which is the reaction product of melamine, formaldehyde, an aliphatic polyol and furfural. The modified phenolic resin exhibits better penetration and flow properties and cures more rapidly. Laminates made with this modified resin can be manufactured at lower pressures and without the lengthy in-press cooling step of the prior art. Moreover, the laminates so produced possess enhanced flexibility due to the internal plasticizing effect of the modifier of the present invention.

REFERENCES:
patent: 2197357 (1940-04-01), Widner et al.
patent: 2294590 (1942-09-01), West
patent: 2502051 (1951-07-01), Lindenfelser et al.
patent: 2507199 (1950-05-01), Eber
patent: 3194723 (1965-07-01), Grudus et al.
patent: 3488310 (1970-01-01), McCombs
patent: 3501429 (1970-03-01), Bonzagni
patent: 3560412 (1971-02-01), Bernardo
patent: 3624035 (1971-11-01), VON Portatius

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