Low pressure bonding of PCD bodies and method

Details Low pressure bonding of PCD bodies and method Low pressure bonding of PCD bodies and method

1988-11-18

1991-07-09

Hunt, Brooks H.

Specialized metallurgical processes, compositions for use therei

Compositions

Consolidated metal powder compositions

51307, 75239, 75240, 75243, 175329, 419 11, C22C 2906, B24D 302

Patent

active

050302760

ABSTRACT:
An improved temperature stable synthetic polycrystalline diamond (PCD) product includes at least one temperature stable PCD integrally and chemically bonded to a matrix carrier support through a carbide forming layer which is of a thickness of at least about 1 micron, the layer on at least one surface of the PCD is in turn bonded to the matrix carrier. A wide variety of shapes, sizes and configurations of such products is achieved through relatively low temperature and relatively low pressure processing. Various products of various geometries are described as well as the details of the processing to achieve chemical bonding of the PCD elements in a variety of support matrix carrier materials to form a unitary structure having a temperature stability up to about 1,200 degrees C.

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