Low powder distribution inductance lead frame for semiconductor

Details Low powder distribution inductance lead frame for semiconductor Low powder distribution inductance lead frame for semiconductor

1991-10-31

1993-07-20

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257691, 257692, H01L 2348, H01L 2350

Patent

active

052296393

ABSTRACT:
A semiconductor integrated chip (IC) package has a lead frame for wire bonding IC chips contained therein. The lead frame power buses are arranged to minimize power bus inductance by assuring that a minimum distance is maintained between a current source path and a current return path which includes the wire bond connections to the chip. Distance is minimized by providing both the current source and current return pins in adjacent pin pairs on opposite sides of the package.

REFERENCES:
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4916519 (1990-04-01), Ward
patent: 4965654 (1990-11-01), Karner et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5115298 (1992-05-01), Loh

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