Low noise integrated circuit package

Details Low noise integrated circuit package Low noise integrated circuit package

1992-02-18

1994-02-08

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257690, 257704, H01L 2302

Patent

active

052850129

ABSTRACT:
The present invention discloses a package for electronic components which reduces the unwanted electronic noise generated by the package and which can be fabricated by conventional manufacturing techniques. Accordingly, a lid for a package housing is fabricated from beryllium oxide and contains a small hole. During assembly, a wire attached to one of the electronic components is inserted through the hole of this lid, and the lid is attached by conventional methods. Finally, the wire protruding through the hole is soldered to the lid, which completes the sealing of the housing and which provides for a hermetic environment for the enclosed electronic components.

REFERENCES:
patent: 3209216 (1965-09-01), Langridge et al.
patent: 3243862 (1966-04-01), Csakvari
patent: 3312771 (1967-04-01), Hessinger et al.
patent: 3404215 (1968-10-01), Burks et al.
patent: 3618203 (1971-11-01), Pryor
patent: 3981069 (1976-09-01), Johansen
patent: 4398208 (1983-08-01), Murano et al.

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