Semiconductor device manufacturing: process – Repair or restoration
Patent
1995-12-18
1998-11-10
Niebling, John
Semiconductor device manufacturing: process
Repair or restoration
438690, 438 98, 438761, H01L 21283
Patent
active
058343210
ABSTRACT:
A method of repairing an open circuit defect in a damaged address line in a thin film electronic imager array is provided that includes the steps of forming a repair area exposing the open circuit defect and portions of the damaged address line adjoining the defect, with a first protective layer disposed over the array surrounding the repair area; depositing a layer of conductive repair material over the array so that a portion of the conductive repair material is disposed in the repair area to form a repair shunt electrically connecting the portions of the address line adjoining the defect; forming a planarized second protective layer over the array; removing portions of the second protective layer to form a planarized surface on the array on which the conductive repair material is exposed except for the repair shunt underlying a plug portion of the second protective layer disposed over the repair area; removing the conductive repair material from the array surface except for the portion underlying the plug portion of the second protective layer; and removing remaining portions of the first protective layer and the second protective layer plug portion from the repair area.
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"A Fast In-Line Repair Process for LCD Panel Mass Production", by K. Sheng et al., SID 92 Digest, pp. 636-640.
General Electric Company
Ingraham Donald S.
Mulpuri S.
Niebling John
Stoner Douglas E.
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