Low nerve, low temperature expandable, curable hot melt sealant

Details Low nerve, low temperature expandable, curable hot melt sealant Low nerve, low temperature expandable, curable hot melt sealant

1990-01-16

1991-05-21

Lieberman, Allan M.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525 98, 525 99, C08L 906, C08L 5102

Patent

active

050176536

ABSTRACT:
The present invention discloses a hot melt sealant comprising a thermosetting styrene butadiene diblock copolymer and a styrene butadiene terpolymer. The composition being capable of flowing, expanding and curing at temperatures below 300.degree. F. Also disclosed is a method of making the sealant and a method of using the sealant.

REFERENCES:
patent: 3933724 (1976-01-01), Mixell
patent: 4120923 (1978-10-01), Kloker et al.
patent: 4172862 (1979-10-01), Maximovich et al.
patent: 4256850 (1981-03-01), Thorsrud
patent: 4360120 (1982-11-01), Samuel et al.
patent: 4386187 (1983-05-01), Grancio et al.
patent: 4680316 (1987-07-01), Douglas
patent: 4693772 (1987-09-01), Douglas
patent: 4699938 (1987-10-01), Minamizaki et al.

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