Low mutual inductance lead frame device

Details Low mutual inductance lead frame device Low mutual inductance lead frame device

1998-11-30

1999-11-02

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438111, H01L 2144

Patent

active

059769157

ABSTRACT:
A packaged semiconductor device, such as a lead frame device, includes a circuit supported within an enclosure. The circuit is coupled to a plurality of conductive leads within the enclosure. The leads extend from the enclosure for electrically coupling the circuit to external circuitry. At least one of the leads is shielded to reduce inductive coupling and crosstalk between the leads during high frequency switching. The shielded lead has a conductive base, a non-conductive layer disposed on the base, and a conductive layer disposed on the non-conductive layer. The non-conductive and conductive layers may be formed prior to electrically coupling the lead to the circuit, or following assembly of the lead frame package. The shielding may extend into the package enclosure, or may terminate external to the enclosure.

REFERENCES:
patent: 5359222 (1994-10-01), Okumotomo et al.
patent: 5378657 (1995-01-01), Lin
patent: 5485037 (1996-01-01), Marrs
patent: 5659198 (1997-08-01), Okulomo et al.
patent: 5679975 (1997-10-01), Wyland et al.
patent: 5753535 (1998-05-01), Ebihara
patent: 5887955 (1999-03-01), Huang et al.

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