Low mutual inductance lead frame device

Details Low mutual inductance lead frame device Low mutual inductance lead frame device

1998-03-31

1999-03-09

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

257666, H01L 23552

Patent

active

058805206

ABSTRACT:
A packaged semiconductor device, such as a lead frame device, includes a circuit supported within an enclosure. The circuit is coupled to a plurality of conductive leads within the enclosure. The leads extend from the enclosure for electrically coupling the circuit to external circuitry. At least one of the leads is shielded to reduce inductive coupling and crosstalk between the leads during high frequency switching. The shielded lead has a conductive base, a non-conductive layer disposed on the base, and a conductive layer disposed on the non-conductive layer. The non-conductive and conductive layers may be formed prior to electrically coupling the lead to the circuit, or following assembly of the lead frame package. The shielding may extend into the package enclosure, or may terminate external to the enclosure.

REFERENCES:
patent: 5359222 (1994-10-01), Okumotomo et al.
patent: 5485037 (1996-01-01), Marrs
patent: 5659198 (1997-08-01), Okutomo et al.
patent: 5679975 (1997-10-01), Wyland et al.

Affiliated with

Also associated with

Rating

Low mutual inductance lead frame device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low mutual inductance lead frame device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low mutual inductance lead frame device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1324315