Low modulus damping film

Adhesive bonding and miscellaneous chemical manufacture – Methods – Making electrical conductors of indefinite length

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29596, 29605, 335216, H02K 1504

Patent

active

047174374

ABSTRACT:
A film is disclosed which will accommodate high shear strain in a rigidly supported epoxy impregnated Nb.sub.3 Sn superconducting coil (SCC). In a generator application the SCC is subjected to a combined load due to differential thermal contraction, magnetic, and centrifugal forces. These strains could lead to coil fracture and resulting degradation of the field and current-carrying properties. A low modulus material at the interface between the SCC and support structure will reduce or distribute the shear strain to an acceptable level, i.e., no degradation in current carrying properties. Two film materials, polyethylene terephthalate Mylar (DuPont Chemical) and polycarbonate Makrofol KG (Mobay chemical) are disclosed as suitable damping or interface films. An adhesive such as the polyurethane Bostik 7070 is used for affixing the film to the winding surface.

REFERENCES:
patent: 3416111 (1968-12-01), Bogner
patent: 3662461 (1972-05-01), Lake et al.
patent: 3705372 (1972-12-01), Gotal et al.
patent: 3931108 (1976-01-01), Binsack
patent: 3991333 (1976-11-01), Laskaris
patent: 4037312 (1977-07-01), Deis
patent: 4038741 (1977-08-01), Schuler
patent: 4467303 (1984-08-01), Laskaris
Dimensional Behavior of Thin-Film Dielectric Polymers in the Temperature Range 4.2 to 300 K, Jelinek & Muller, 7/22/75 (1st Inter. Cyrogenic Mat'ls Conf.) Plenum Press, New York, pp. 312-315.
Non Metallic Materials and Composites at Low Temperatures, Muller, 1978, International Cyrogenic Materials Conference Board, pp. 339-363.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low modulus damping film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low modulus damping film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low modulus damping film will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-7258

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.