Low-melting alloy and cream solder using a powder of the alloy

Details Low-melting alloy and cream solder using a powder of the alloy Low-melting alloy and cream solder using a powder of the alloy

1996-07-12

2000-07-11

Andrews, Melvyn

Metal treatment

Compositions

Fluxing

2282629, 420587, B23K 3534

Patent

active

060866837

ABSTRACT:
Ag and Cu are added to a base material of a Sn/Pb/Bi composition. Since Bi is contained in greater quantities in Sn/Pb, the alloy has a low melting point (120 to 150.degree. C.) and is surely melted at reflow temperatures from 170 to 200.degree. C. Preferably, the addition amount of Ag is from 0.1 to 5 wt % and the addition amount of Cu is from 0.05 to 1.0 wt %. A low-melting alloy having all the required performances and excellent with view points of cost and safety and a cream solder using a powder of the alloy can be obtained.

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