Low mass ultrasonic bonding tool

Details Low mass ultrasonic bonding tool Low mass ultrasonic bonding tool

1996-11-15

1999-04-06

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 45, 310323, B23K 2010

Patent

active

058906436

ABSTRACT:
A novel low mass transducer for bonding machines comprises a transducer generator which mounts on or is coupled to a bonding tool of the type used for ball bonding, wedge bonding and TAB bonding. The preferred embodiment transducer comprises a magnetostrictive or piezoelectric element which mount on the outside surface of the bonding tools used in a bonding operation, thus eliminating convention transducers which also serve as a bonding tool holder. The present invention bonding tool serves as the base or mount for a transducer made in the form of a sleeve or tube which mounts on or couples to the bonding tool. The novel transducer/bonding tool or transducers also serve as a sensor which can monitor the quality of a bond while it is being made.

REFERENCES:
patent: 5465259 (1995-11-01), Barlow et al.
patent: 5563973 (1996-10-01), Miller et al.
patent: 5702049 (1997-12-01), Biggs et al.

Affiliated with

Also associated with

Rating

Low mass ultrasonic bonding tool does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low mass ultrasonic bonding tool, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low mass ultrasonic bonding tool will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1363552