Low-loss, low-inductance interconnect for microcircuits

Details Low-loss, low-inductance interconnect for microcircuits Low-loss, low-inductance interconnect for microcircuits

1995-11-21

1997-10-07

Gensler, Paul

Wave transmission lines and networks

Plural channel systems

174117F, 333236, H01P 308, H01P 500

Patent

active

056752989

ABSTRACT:
A low-loss, low-inductance metal interconnect for an electrical signal in a microcircuit comprises a plurality of spaced-apart generally parallel metal interconnect lines disposed in a plane over an insulating layer. The metal interconnect lines are interleaved with and electrically insulated from a plurality of spaced-apart generally parallel metal lines disposed in the plane. The metal interconnect lines together comprise a signal interconnect path, and the metal lines are coupled to a fixed voltage potential, such as ground.

REFERENCES:
patent: 3179904 (1965-04-01), Paulsen
patent: 3763306 (1973-10-01), Marshall
patent: 4835496 (1989-05-01), Schellenberg et al.
patent: 5543751 (1996-08-01), Stedman et al.

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