Low loss interconnect structure for use in microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Gate arrays – With particular signal path connections

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S776000, C327S295000

Reexamination Certificate

active

06909127

ABSTRACT:
A low loss on-die interconnect structure includes first and second differential signal lines on one of the metal layers of a microelectronic die. One or more traces may also be provided on another metal layer of the die that are non-parallel (e.g., orthogonal) to the differential signal lines. Because the traces are non-parallel, they provide a relatively high impedance return path for signals on the differential signal lines. Thus, a signal return path through the opposite differential line predominates for the signals on the differential lines. In one application, the low loss interconnect structure is used within an on-die salphasic clock distribution network.

REFERENCES:
patent: 5387885 (1995-02-01), Chi
patent: 5397943 (1995-03-01), West et al.
patent: 5410491 (1995-04-01), Minami
patent: 5497109 (1996-03-01), Honda et al.
patent: 5519351 (1996-05-01), Matsumoto
patent: 5521541 (1996-05-01), Okamura
patent: 5570045 (1996-10-01), Erdal et al.
patent: 5668484 (1997-09-01), Nomura
patent: 5691662 (1997-11-01), Soboleski et al.
patent: 5717229 (1998-02-01), Zhu
patent: 5761253 (1998-06-01), Fujita et al.
patent: 5969559 (1999-10-01), Schwartz
patent: 6005428 (1999-12-01), Amdahl
patent: 6037822 (2000-03-01), Rao et al.
patent: 6043704 (2000-03-01), Yoshitake
patent: 6144224 (2000-11-01), Lee et al.
patent: 6150865 (2000-11-01), Fluxman et al.
patent: 6157688 (2000-12-01), Tamura et al.
patent: 6184736 (2001-02-01), Wissell et al.
patent: 6198307 (2001-03-01), Garlepp et al.
patent: 6211714 (2001-04-01), Jeong
patent: 6239387 (2001-05-01), Wissell
patent: 6255884 (2001-07-01), Lewyn
patent: 6311313 (2001-10-01), Camporese et al.
patent: 6323714 (2001-11-01), Naffziger et al.
patent: 6397375 (2002-05-01), Block et al.
patent: 6411151 (2002-06-01), Nair et al.
patent: 6420663 (2002-07-01), Zelikson et al.
patent: 6429714 (2002-08-01), Schultz
patent: 6532544 (2003-03-01), Masleid et al.
patent: 6556089 (2003-04-01), Wood
patent: 6570429 (2003-05-01), Hellriegel
patent: 6624719 (2003-09-01), Anderson et al.
patent: 2002/0083359 (2002-06-01), Dow
patent: 2002/0190775 (2002-12-01), Magoshi
patent: 2003/0001652 (2003-01-01), O'Mahony et al.
patent: 1376747 (2004-01-01), None
patent: 1-289155 (1989-11-01), None
patent: 2-158165 (1990-06-01), None
Restle et al. “Desgning the Best Clock Distribution Network” IEEE Symposium on VLSI Circuits Digest of Techincal Papers, 1998.
Chi “Salphasic distributio of clock signals for synchronous systems” (IEEE transactions on computers, vol. 43, No. 5, May 1994).
Bakoglu, H.B.,Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley Publishing Company, (1990), Table of Contents.
Bernstein, K., et al.,High Speed CMOS Design Styles, Kluwer Academic Publishers, (1998), Table of Contents.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Low loss interconnect structure for use in microelectronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low loss interconnect structure for use in microelectronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low loss interconnect structure for use in microelectronic... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3481357

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.