Low-loss integrated waveguide feed for wafer-scale...

Wave transmission lines and networks – Plural channel systems – Having branched circuits

Reexamination Certificate

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C343S754000, C343S771000, C342S368000

Reexamination Certificate

active

07411472

ABSTRACT:
A wafer-scale heterogeneous layered active electronically scanned array (ESA) utilizes a low-loss integrated waveguide feed. The ESA is formed from wafer-scale subarray modules each of which comprises a multilayer stack to form transmit/receive (T/R) modules. Waveguide subarray combiners feed the T/R modules. A subarray combiner is a waveguide assembly bonded to a bottom layer in the multilayer stack. The bottom layer is a ground plane forming a top waveguide broadwall of the combiner. The waveguide subarray combiner may be formed from a variety of waveguide types and feeds the T/R modules using electric field probe coupling or an aperture slot coupling. A second layer feed structure forms the subarray modules into the ESA and feeds the waveguide subarray combiners. The second layer feed structure uses waveguides to feed the waveguide subarray combiners using E-field probes or aperture slot coupling on the bottom waveguide broadwall.

REFERENCES:
patent: 6232920 (2001-05-01), Brookner et al.
patent: 6421021 (2002-07-01), Rupp et al.
patent: 6677899 (2004-01-01), Lee et al.
“Wafer-Scale Integration Brings Low Cost and a Small Footprint to Active Antenna Arrays”, by Fred Mohamadi, RF Design, Feb. 2005.
“Breaking the Thermal Barrier in Microelectronics” News Link, Institute of Microelectronics, Oct. 2004, p. 3.

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