Low k polymer E-beam printable mechanical support

Details Low k polymer E-beam printable mechanical support Low k polymer E-beam printable mechanical support

2005-12-06

2005-12-06

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Rendering selected devices operable or inoperable

C438S618000, C438S623000, C438S624000, C438S631000, C438S633000, C438S778000, C438S781000

Reexamination Certificate

active

06972217

ABSTRACT:
A low-k interconnect dielectric layer is strengthened by forming pillars of hardened material in the low-k film. An E-beam source is used to expose a plurality of pillar locations. The locations are exposed with a predetermined power and exposure time to convert the low-k film in the selected locations to pillars having higher hardness and strength than the surrounding portions of the low-k film.

REFERENCES:
patent: 6077764 (2000-06-01), Sugiarto et al.
patent: 6080526 (2000-06-01), Yang et al.
patent: 6245663 (2001-06-01), Zhao et al.
patent: 2003/0087191 (2003-05-01), Lavallee et al.
patent: 2004/0048960 (2004-03-01), Peterson et al.
patent: 2004/0058277 (2004-03-01), He et al.

Affiliated with

Also associated with

Rating

Low k polymer E-beam printable mechanical support does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low k polymer E-beam printable mechanical support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low k polymer E-beam printable mechanical support will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3468761