Low-insertion force solder-bearing lead

Details Low-insertion force solder-bearing lead Low-insertion force solder-bearing lead

1982-10-29

1984-11-13

McQuade, John

Geometrical instruments

339258R, 339275B, H01R 402

Patent

active

044821972

ABSTRACT:
A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more than 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation. During the assembling operation, compressive forces also are applied to the lead (10) above and below substrate-engaging stop tabs (56) to force the clamping finger (20) and the contact finger (22) into firm engagement with respective opposite sides of the substrate circuit device (16).

REFERENCES:
patent: 3351704 (1967-11-01), Sitzler
patent: 3601775 (1971-08-01), Longenecker et al.
patent: 3750252 (1973-08-01), Landman
patent: 3953102 (1976-04-01), Rivetta et al.
patent: 3993383 (1976-11-01), Marino
patent: 4019803 (1977-04-01), Schell
patent: 4028794 (1977-06-01), Ritchie et al.
patent: 4085998 (1978-04-01), Owens
patent: 4120558 (1978-10-01), Seidler
patent: 4177554 (1979-12-01), Deveres et al.
patent: 4203648 (1980-05-01), Seidler
patent: 4302067 (1981-11-01), Monson et al.
patent: 4345814 (1982-08-01), Gutbier et al.
patent: 4357069 (1982-11-01), Milora
patent: 4379608 (1983-04-01), Olsson et al.
patent: 4433892 (1984-02-01), Seidler

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