Low-insertion force method of assembling a lead and a substrate

Details Low-insertion force method of assembling a lead and a substrate Low-insertion force method of assembling a lead and a substrate

1982-10-29

1985-03-12

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

339258P, H05K 300

Patent

active

045036098

ABSTRACT:
A low-insertion force solder-bearing lead (10) includes a resilient clamping finger (20) having an inner planar surface (48) for engaging a planar surface (50) of a substrate circuit device (16) in parallel mating relationship. Respective portions (26 and 28) of a resilient contact finger (22) and a solder preform (12) define a noncircular camming surface (58) which extends relative to the inner planar surface (48) of the clamping finger (20) at an angle of not more that 45.degree. to facilitate flexing of the contact finger in the assembling of the lead (10) to the substrate circuit device (16). Portions (68) of the solder preform (12) smear across a contact pad (14) during the lead assembling operation to facilitate wetting of the preform to the contact pad in a subsequent soldering operation. During the assembling operation, compressive forces also are applied to the lead (10) above and below substrate-engaging stop tabs (56) to froce the clamping finger (20) and the contact finger (22) into firm engagement with respective opposite sides of the substrate circuit device (16).

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patent: 4348071 (1982-09-01), Hsieh
patent: 4357069 (1982-11-01), Milora

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