Low inertia movable workstation

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder

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228 62, 228 447, 228 491, B23K 3704

Patent

active

046193952

ABSTRACT:
The present invention provides a new and improved workstation for holding a semiconductor device opposite the bonding tool of an automatic wire bonder during a bonding operation. The workstation is mounted on a retractable pedestal which is vertically and rotationally movable by a high speed vertical axis drive motor and a high speed theta drive motor which are mounted on a workstation base in fixed positions and coupled to said pedestal for imparting motion thereto. The movable pedestal and workstation are adapted to unload a semiconductor device from a boat or holder and accurately position the top of the semiconductor device at a predetermined bonding height opposite the bonding tool. The workstation and pedestal are retractable to return the semiconductor device to the holder and the control means are adapted to move the holder horizontally to index a new semiconductor device over the workstation prior to the semiconductor device being unloaded from the holder and positioned opposite the bonding tool of an automatic wire bonder.

REFERENCES:
patent: 3149510 (1964-09-01), Kulicke, Jr.
patent: 3477630 (1969-11-01), Schneider
patent: 3774834 (1973-11-01), Holler et al.
patent: 4039114 (1977-08-01), Yoshida et al.
patent: 4103814 (1978-08-01), Nishioka
patent: 4239144 (1980-12-01), Elles et al.
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4404741 (1983-09-01), Lebet et al.

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