Low inertia microcircuit test fixture

Details Low inertia microcircuit test fixture Low inertia microcircuit test fixture

1999-06-19

2001-05-22

Metjahic, Safet (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S758010, C324S754090

Reexamination Certificate

active

06236221

ABSTRACT:

SUMMARY OF THE INVENTION
A low inertia low signal level microcircuit test fixture is disclosed herein which includes a high resistivity fixture body having an upper surface and a lower surface and having a maximum body density of 1.9 gm/cm
3
. A plurality of adjacent electrically conductive lands are formed on the fixture upper body surface. A plurality of grooves are positioned between and separating ones of the adjacent electrically conductive lands. At least one accessible electrical connection is available in communication with the adjacent electrically conductive lands.
In another aspect of the invention a low inertia low signal level microcircuit test fixture for mounting on a microcircuit testing apparatus is disclosed which includes a high resistivity fixture body having a body mass density of 1.9 gm/cm
3
maximum. The fixture body has an upper surface and a lower surface, the upper surface having a flatness within ±0.0005 inches. The upper surface and the lower surface are parallel within ±0.0007 inches.
In yet another aspect of the invention a low inertial microcircuit test fixture is disclosed wherein a fixture body has a dielectric strength greater than 400 volts/mil and a mass density less than 1.9 gm/cm
3
. The fixture body has an upper surface and a lower surface thereon. A first electrically conductive layer is attached to and covers the upper surface. A second electrically conductive layer is electrically isolated from the first electrically conductive layer and is attached to and covers the lower surface. Means is provided for separate accessible electrical contact with the first and the second electrically conductive layers.


REFERENCES:
patent: 5559444 (1996-09-01), Farnworth et al.
patent: 5634267 (1997-06-01), Farnworth et al.
patent: 6028436 (2000-02-01), Akram et al.

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