Low inductance mount for decoupling capacitors

Details Low inductance mount for decoupling capacitors Low inductance mount for decoupling capacitors

2007-09-11

2007-09-11

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

Reexamination Certificate

active

11037709

ABSTRACT:
A low inductance mount for decoupling capacitors. In one embodiment, a circuit carrier such as a printed circuit board (PCB) includes a surface layer, a first layer adjacent to the surface layer, and a second layer adjacent to the first layer. A conductive region is implemented on the surface layer, and is electrically coupled to a first circuit plane in the first layer. At least one mounting pad is located on the surface layer of the PCB within the conductive region. The mounting pad is electrically isolated from the remainder of the conductive region and is electrically coupled to a second circuit plane in the second layer. A capacitor is mounted on the PCB, wherein a first terminal of the capacitor is coupled to the conductive region and a second terminal is coupled to the mounting pad.

REFERENCES:
patent: 6215372 (2001-04-01), Novak
patent: 6229095 (2001-05-01), Kobayashi
patent: 6940458 (2005-09-01), Mukai et al.
patent: 6941537 (2005-09-01), Jessep et al.
patent: 2001/0018982 (2001-09-01), Gotoh et al.
patent: 2004/0070956 (2004-04-01), Antu et al.

Affiliated with

Also associated with

Rating

Low inductance mount for decoupling capacitors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Low inductance mount for decoupling capacitors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low inductance mount for decoupling capacitors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3765415