Low inductance interconnect having a comb-like resilient structu

Details Low inductance interconnect having a comb-like resilient structu Low inductance interconnect having a comb-like resilient structu

1997-09-05

2000-02-22

Lee, Benny

Wave transmission lines and networks

Long line elements and components

Connectors and interconnections

333 99R, 333 22R, H01P 104

Patent

active

060284986

ABSTRACT:
A low inductance interconnect suitable for microwave frequency interconnect applications. The invention provides a low inductance interconnect structure providing interconnection operable from DC to beyond 100 Ghz. The structure may be in the form of a resilient comb, and can be cut from thin sheet metal with a Wire Electric Discharge Machine (EDM). Other resilient forms include spring structures, resilient canes and conductive fuzz.

REFERENCES:
patent: 3221286 (1965-11-01), Fedde
patent: 3582833 (1971-06-01), Kordos
patent: 3795037 (1974-03-01), Luttmer
patent: 3795884 (1974-03-01), Kotaka
patent: 4394633 (1983-07-01), Klein
patent: 5432486 (1995-07-01), Wong

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