Low impedance test fixture for impedance measurements

Details Low impedance test fixture for impedance measurements Low impedance test fixture for impedance measurements

2008-04-29

2008-04-29

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S1540PB

Reexamination Certificate

active

11312904

ABSTRACT:
A test fixture couples with a test instrument to measure impedance of a device. An upper layer of the test fixture has (a) a first and a second solder pad for electrical connection to the device, (b) a first, second, third and fourth multi-solder pad for electrical connection to four connectors, (c) a first conductor track for connecting the first solder pad to a signal solder pad of the first multi-solder pad, (d) a second conductor track for connecting the first solder pad to a signal solder pad of the second multi-solder pad, (e) a third conductor track for connecting the second solder pad to a signal solder pad of the third multi-solder pad, and (f) a fourth conductor track for connecting the second solder pad to a signal solder pad of the fourth multi-solder pad. Each multi-solder pad has at least one return path solder pad. A lower layer of the test fixture has conductor tracks connected to the return path solder pad of each multi-solder pad. A dielectric substrate of the test fixture has substantially uniform thickness separating the upper layer from the bottom layer.

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International Search Report, Related Application Serial No. PCT/US04/019760, Dec. 12, 2004.
Written Opinion, Related Application Serial No. PCT/US04/019760, Dec. 12, 2004.
Response to Written Opinion, Related Application Serial No. PCT/US04/019760, filed Apr. 20, 2005.

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