Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-02-22
1995-02-07
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361734, 361775, 361502, H05H 720
Patent
active
053880285
ABSTRACT:
A low impedance interconnection assembly for use with high frequency switching power semiconductor devices includes a low inductance modular capacitor, multi-layer planar bus structure and semiconductor switching devices assembled as a laminated unitary structure. Terminals electrically and physically connect the positive electrode of the modular capacitor to the positive DC voltage potential carried by the bus structure and the positive DC input of the semiconductor switch and other terminals electrically and mechanically couple the negative electrode of the modular capacitor to the negative DC voltage potential layer of the bus structure and the negative DC input of the switching device. The low inductance modular capacitor is made of a number of capacitor elements having their respective positive electrodes bonded to a copper foil pattern strip to define a positive electrode and their respective negative electrode terminals to a second copper foil strip to define the negative electrode. All capacitors share in supplying high slew rate current to the semiconductor switching devices to reduce losses in the capacitor.
REFERENCES:
patent: 4755910 (1988-07-01), Val
patent: 4965123 (1990-02-01), Windle et al.
patent: 5053920 (1991-10-01), Staffiere et al.
patent: 5227960 (1993-07-01), Kunishi et al.
patent: 5303118 (1994-04-01), Saito et al.
Kaman Electromagnetics Corporation
Thompson Gregory D.
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