Low impedance connection for an EMI containment shield including

Details Low impedance connection for an EMI containment shield including Low impedance connection for an EMI containment shield including

1997-01-17

1999-10-12

Kincaid, Kristine

Electricity: conductors and insulators

Anti-inductive structures

Conductor transposition

174 51, 174 35C, H05K 900

Patent

active

059658428

ABSTRACT:
The present invention provides an EMI shield having a low impedance connection to ground for use in electronic equipment, particularly computer systems. More particularly, an EMI shield for electronic equipment is disclosed which includes a conductive ribbon, such as a copper ribbon with a polyimide backing, the conductive ribbon having openings and coupled to a ground plane. The conductive ribbon contacts a surface of a section of the electronic equipment to be shielded. A hold down frame of a non-conductive material holds the conductive ribbon in a fixed position on the section of the electronic equipment to be shielded. A metal plating, such as a combination of copper and nickel, bonds to the section of the electronic equipment to be shielded and to the conductive ribbon. The metal plating contains the EMI. The plating also bonds to the section of the electronic equipment through the openings of the conductive ribbon wherein the metal plating and the conductive ribbon form a low impedance connection to ground. In one embodiment the openings in the conductive ribbon are slots and in another the openings are circular holes.

REFERENCES:
patent: 5017419 (1991-05-01), Smith
patent: 5330365 (1994-07-01), Leeson
patent: 5500789 (1996-03-01), Miller et al.
patent: 5519585 (1996-05-01), Jones et al.
patent: 5631446 (1997-05-01), Quan

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