Low haze wafer treatment process

Details Low haze wafer treatment process Low haze wafer treatment process

1998-10-21

2000-03-14

Powell, William

Semiconductor device manufacturing: process

Chemical etching

Liquid phase etching

438754, 438756, 252 793, H01L 2100

Patent

active

060372710

ABSTRACT:
A process for removing a plurality of layers of different materials from a substrate having a silicon material base, at least one of said layers being a silicon oxide material and at least one other of said layers comprising a metal and the metal layer being located above the silicon oxide layer. The process includes the steps of treating the substrate with a series of chemical formulations adapted to successively remove the materials of the plurality of layers until the silicon material base is exposed, the silicon oxide layer being removed by treatment with HF, wherein the HF treatment to remove said silicon oxide layer comprises exposing the substrate to:

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