Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating contains embedded solid material
Patent
1996-04-04
1997-09-16
Gorgos, Kathryn L.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating contains embedded solid material
205254, 205299, 205302, C25D 1500
Patent
active
056676590
ABSTRACT:
The present invention relates to a solution and method for plating tin, lead, or tin-lead alloy deposits which contain a co-deposit of fluorocarbon particles to provide a lower-friction solder-type deposit which reduces insertion force and fretting corrosion in separable electronic connectors. The fluorocarbon particles have a size between about 0.1 to 1 .mu.m in diameter, and reduce the coefficient of friction of the resultant deposit to 0.8 or less. Also, the deposit has excellent mechanical properties and can be successfully soldered.
REFERENCES:
patent: 2525942 (1950-10-01), Proell
patent: 4098654 (1978-07-01), Helle et al.
patent: 4565609 (1986-01-01), Nobel et al.
patent: 4599149 (1986-07-01), Nobel et al.
patent: 4701244 (1987-10-01), Nobel et al.
patent: 4880507 (1989-11-01), Toben et al.
patent: 4994155 (1991-02-01), Toben et al.
patent: 5066367 (1991-11-01), Nobel et al.
patent: 5141702 (1992-08-01), Guenin et al.
Bapu, G.N.K. Ramesh et al., "Electrodeposition of Nickel-Polytetrafluoroethylene (PTFE) Polymer Composites," Plating & Surface Finishing, 86-88 (Apr. 1995).
Bhalla, V. et al., "Friction and Wear Characteristics of Electrodeposited Copper Composites," Plating & Surface Finishing, 58-61 (Nov. 1995).
Molvar Allen E.
Souza Therese R.
Gorgos Kathryn L.
Handy & Harman
Mayekar Kishor
LandOfFree
Low friction solder electrodeposits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low friction solder electrodeposits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low friction solder electrodeposits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-215545