Low formaldehyde emission urea-formaldehyde resins containing a

Details Low formaldehyde emission urea-formaldehyde resins containing a Low formaldehyde emission urea-formaldehyde resins containing a

1983-10-11

1985-08-20

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563313, 264128, 428326, 428528, 524598, 524843, 528256, C09J 502

Patent

active

045362459

ABSTRACT:
A melamine-urea-formaldehyde resin characterized by a low rate of formaldehyde emission when cured. Made by a process where the initial reaction mixture has an F/U molar ratio of from about 3:1 to about 1:1, and undergoes a methylolation reaction at an alkaline pH. Preferably at least some of the melamine is present in the initial reaction mixture. The subsequent condensation is at a substantially neutral pH. Has a final F/U molar ratio of 1.3:1 to 0.9:1, a final F/Ueq molar ratio of 1.3:1 to 0.7:1, and a melamine content of from 0.15% to 40% by weight, dry solids basis. Useful for adhesive purposes, particularly as a particleboard binder characterized by low emission rate.

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International Polymer Science, vol. 1, No. 5, pp. 60-61, (1974).
Chemical Abstracts, vol. 83, p. 63, No. 80460b (1975); Abstract of Japan Kokai No. 75-35,230.

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