Low firing temperature ceramic materials

Details Low firing temperature ceramic materials Low firing temperature ceramic materials

1987-10-19

1988-07-05

Bell, Mark L.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

501 32, 501 66, 501128, 501153, 501 21, C03C 814, C04B 3510

Patent

active

047554908

ABSTRACT:
A dense, sintered ceramic material having a low dielectric constant and a low coefficient of thermal expansion is provided from a mixture of 10-50 wt. % alumina, 0-30 wt. % fused silica, and 50-60 wt. % of a frit comprised of CaO, MgO, Al.sub.2 O.sub.3, B.sub.2 O.sub.3, and SiO.sub.2. The mixture has a minimum sintering temperature in the range of 850.degree.-1000.degree. C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates.

REFERENCES:
patent: 3019116 (1962-01-01), Doucette
patent: 3457091 (1969-07-01), Gupta
patent: 4481261 (1984-11-01), Johnson et al.
patent: 4536329 (1985-08-01), Hormadaly
patent: 4537703 (1985-08-01), Hormadaly

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