Low-expansion unit, method of manufacturing the same and...

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...

Reexamination Certificate

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C428S679000, C428S681000

Reexamination Certificate

active

07087316

ABSTRACT:
A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

REFERENCES:
patent: 5590524 (1997-01-01), Moore et al.
patent: 5604378 (1997-02-01), Kimura et al.
patent: 5844310 (1998-12-01), Okikawa et al.
patent: 6032362 (2000-03-01), Okikawa et al.
patent: 6045927 (2000-04-01), Nakanishi et al.
patent: 6114048 (2000-09-01), Jech et al.
patent: 6129993 (2000-10-01), Kumamoto et al.
patent: 6154364 (2000-11-01), Girrens et al.
patent: 6391422 (2002-05-01), Mori et al.
patent: 6753093 (2004-06-01), Tanaka et al.
patent: 6902843 (2005-06-01), Ishizuka et al.
patent: 0 871 219 (1998-10-01), None
patent: 63-20448 (1988-02-01), None
patent: 63-20449 (1988-02-01), None
Daniel Giesecke et al., “High Power Thick Film Circuitry on Pecos (Porcelain Enamel Coating on Steel) Substrates,” Electro International 1994 Conference Proceedings, Boston, MA, May 10-12, 1994, pp. 847-854.

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