Low EMI emissions heat sink device

Details Low EMI emissions heat sink device Low EMI emissions heat sink device

2000-02-03

2000-08-29

Atkinson, Christopher

Heat exchange

Intermediate fluent heat exchange material receiving and...

Liquid fluent heat exchange material

16510423, 62 31, 622592, 361700, 257715, F28D 1500

Patent

active

061093432

ABSTRACT:
A low electromagnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electromagnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.

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