Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material
Patent
1998-04-27
2000-04-04
Atkinson, Christopher
Heat exchange
Intermediate fluent heat exchange material receiving and...
Liquid fluent heat exchange material
16510423, 62 31, 622592, 361700, 257715, F28D 1500
Patent
active
060448997
ABSTRACT:
A low electro-magnetic radiation emissions heat sink that dissipates heat away from an integrated circuit package by means of conduction to the electronic chassis. The heat sink may also include a ferrite ring for reducing electro-magnetic radiation emissions from the integrated circuit package by increasing the electrical impedance of the EMI transmission path between the integrated circuit package and the electronic chassis, thus reducing the capacitive coupling and RFI concerns of conductive heat dissipation. The heat sink of the present invention may also include fins that are external to the electronic chassis for greater heat dissipation by means of external air convection.
REFERENCES:
patent: 3024298 (1962-03-01), Goltsos et al.
patent: 3209062 (1965-09-01), Scholz
patent: 3739234 (1973-06-01), Bylund et al.
patent: 4332135 (1982-06-01), Barclay et al.
patent: 4681995 (1987-07-01), Ahern et al.
patent: 4819011 (1989-04-01), Yokota
patent: 5343940 (1994-09-01), Jean
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5731954 (1998-03-01), Cheon
patent: 5755278 (1998-05-01), Shinohara et al.
patent: 5764483 (1998-06-01), Ohashi et al.
patent: 5808869 (1998-09-01), Donahoe et al.
patent: 5842514 (1998-12-01), Zapach et al.
patent: 5910883 (1999-06-01), Cipolla et al.
patent: 5917699 (1999-06-01), Hung et al.
Boone Douglas
Langley Philip David
Atkinson Christopher
Hewlett--Packard Company
Mitchell Cynthia S.
LandOfFree
Low EMI emissions heat sink device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Low EMI emissions heat sink device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Low EMI emissions heat sink device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-356813