Low ejection energy micro-fluid ejection heads

Details Low ejection energy micro-fluid ejection heads Low ejection energy micro-fluid ejection heads

2007-03-27

2007-03-27

Meier, Stephen (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S061000, C347S062000

Reexamination Certificate

active

10927796

ABSTRACT:
A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

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