Low dissipation factor epoxy coating powder

Details Low dissipation factor epoxy coating powder Low dissipation factor epoxy coating powder

1979-05-17

1980-12-23

Nielsen, Earl A.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

260 37EP, 427120, 427185, 427195, 528 92, 528104, 528112, C08G 5942, C08G 5968

Patent

active

042411017

ABSTRACT:
A coating powder is disclosed which is prepared from a solventless non-aqueous composition of a solid epoxy resin having an epoxy equivalent weight of about 400 to about 8000, a Durran's softening point of at least 70.degree., a solid polyanhydride curing agent at least about 50 mole % of which is trimellitic anhydride, and a cross-linking agent having the general formula R.sub.3 SnX where each R is selected from alkyl, aryl, aralkyl, and alkaryl up to C.sub.20 and X is selected from acetate, propionate, butyrate, halogen, and hydroxyl. The composition is dry-blended and then melt-mixed at 50.degree. to 150.degree. C. To prepare the coating powder, it is then cooled, crushed, and ground to a particle size of less than 100 microns. The coating powder is electrostatically applied to a conductor and is cured above the melting point of the resin.

REFERENCES:
patent: 3244670 (1966-04-01), Puchala et al.
patent: 3344096 (1967-09-01), Manasia et al.
patent: 3400098 (1968-09-01), Parry
patent: 3477971 (1969-11-01), Allen et al.
patent: 3506598 (1970-04-01), Groff et al.
patent: 4009223 (1977-02-01), Noonan
patent: 4040993 (1977-08-01), Elbling et al.

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