Low dielectric printed circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

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Details

361414, 174 685, 333238, H05K 336, H05K 114

Patent

active

048647225

ABSTRACT:
The invention features a method of fabricating a printed circuit board with low dielectric materials using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Dielectric materials are chosen which enhance the performance of the circuit board.

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